Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Yu-Ting Cheng*, W. T. Hsu, L. Lin, C. T. Nguyen, K. Najafi

*Corresponding author for this work

Research output: Contribution to conferencePaper

37 Scopus citations

Abstract

A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

Original languageEnglish
Pages18-21
Number of pages4
DOIs
StatePublished - 1 Jan 2001
Event14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
Duration: 21 Jan 200125 Jan 2001

Conference

Conference14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
CountrySwitzerland
CityInterlaken
Period21/01/0125/01/01

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