A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.
|Number of pages||4|
|State||Published - 1 Jan 2001|
|Event||14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland|
Duration: 21 Jan 2001 → 25 Jan 2001
|Conference||14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)|
|Period||21/01/01 → 25/01/01|