Using buried capacitor in LTCC-MLC balun

Ching Wen Tang, Chi-Yang Chang*

*Corresponding author for this work

Research output: Contribution to journalArticle

11 Scopus citations

Abstract

A novel chip-type ceramic balun designed in the 2.4 GHz ISM band frequency is presented. A buried capacitor is included in the balun, so that the length of the coupled transmission lines can be reduced and can be designed very easily. A meander or spiral broadside coupled-line is adopted to realise the proposed LTCC multi-layer balun. The measured performances of phase and amplitude balance for this LTCC-MLC balun show a good match with computer simulation.

Original languageEnglish
Pages (from-to)801-803
Number of pages3
JournalElectronics Letters
Volume38
Issue number15
DOIs
StatePublished - 18 Jul 2002

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