Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

Hsi-Kuei Cheng; Yu-Jie Lin; Hou-Chien Chang; Kuo-Chio Liu; Ying-Lang Wang; Tzeng-Feng Liu; Chih Ming Chen

doi:10.1007/s11661-015-2825-4

Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

Hsi-Kuei Cheng, Yu-Jie Lin, Hou-Chien Chang, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih Ming Chen

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015

Original language	English
Pages (from-to)	1834-1837
Number of pages	4
Journal	Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume	46A
Issue number	5
DOIs	https://doi.org/10.1007/s11661-015-2825-4
State	Published - May 2015

Keywords

BUMP METALLIZATION; SOLDER; RELIABILITY

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@article{65dc58602f7d4956ac43785773802464,

title = "Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing",

abstract = "The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015",

keywords = "BUMP METALLIZATION; SOLDER; RELIABILITY",

author = "Hsi-Kuei Cheng and Yu-Jie Lin and Hou-Chien Chang and Kuo-Chio Liu and Ying-Lang Wang and Tzeng-Feng Liu and Chen, {Chih Ming}",

year = "2015",

month = may,

doi = "10.1007/s11661-015-2825-4",

language = "English",

volume = "46A",

pages = "1834--1837",

journal = "Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science",

issn = "1073-5623",

publisher = "Springer Boston",

number = "5",

}

Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing. / Cheng, Hsi-Kuei; Lin, Yu-Jie; Chang, Hou-Chien; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih Ming.

In: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science, Vol. 46A, No. 5, 05.2015, p. 1834-1837.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

AU - Cheng, Hsi-Kuei

AU - Lin, Yu-Jie

AU - Chang, Hou-Chien

AU - Liu, Kuo-Chio

AU - Wang, Ying-Lang

AU - Liu, Tzeng-Feng

AU - Chen, Chih Ming

PY - 2015/5

Y1 - 2015/5

N2 - The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015

AB - The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015

KW - BUMP METALLIZATION; SOLDER; RELIABILITY

U2 - 10.1007/s11661-015-2825-4

DO - 10.1007/s11661-015-2825-4

M3 - Article

VL - 46A

SP - 1834

EP - 1837

JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

SN - 1073-5623

IS - 5

ER -