Ultralow switching energy Ni/GeOx/HfON/TaN RRAM

C. H. Cheng, Albert Chin, F. S. Yeh

Research output: Contribution to journalArticle

34 Scopus citations

Abstract

Using stacked covalent-bond-dielectric GeOx on metaloxynitride HfON, the NiGeOx/HfON/TaN resistive random access memory (RRAM) showed ultralow set power of 0.3 μW (0.1 μA at 3 V), reset power of 0.6 nW (-0.3 nA at 1.8 V), fast 20-ns switching time, ultralow 8-fJ switching energy (4-V overstress), and excellent 10-6 cycling endurance. Such excellent performance was reached by using hopping conduction with negative temperature coefficient (TC) rather than the positive TC in metaloxide RRAM.

Original languageEnglish
Article number5680574
Pages (from-to)366-368
Number of pages3
JournalIEEE Electron Device Letters
Volume32
Issue number3
DOIs
StatePublished - 1 Mar 2011

Keywords

  • GeO
  • HfON
  • hopping conduction
  • resistive random access memory (RRAM)

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