Ultra-high light extraction efficiency and ultra-thin mini-LED solution by freeform surface chip scale package array

Che Hsuan Huang, Chieh Yu Kang, Shu Hsiu Chang, Chih Hao Lin, Chun Yu Lin, Tingzhu Wu*, Chin Wei Sher, Chien-Chung Lin, Po-Tsung Lee, Hao-Chung Kuo

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.

Original languageEnglish
Article number202
JournalCrystals
Volume9
Issue number4
DOIs
StatePublished - 1 Apr 2019

Keywords

  • Chip scale package
  • Freeform design
  • Light emitting diode
  • Mini LED

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