To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

Chih Chia Hu, Hsiang Yao Hsiao, Ming Yung Guo, Chih Chen*, King-Ning Tu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu 6Sn 5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded.

Original languageEnglish
Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages503-506
Number of pages4
DOIs
StatePublished - 1 Dec 2011
Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore
Duration: 7 Dec 20119 Dec 2011

Publication series

Name2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Conference

Conference2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
CountrySingapore
CitySingapore
Period7/12/119/12/11

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