Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules

Chia Chi Yu, Hsin-Jay Wu*, Matthias T. Agne, Ian T. Witting, Ping Yuan Deng, G. Jeffrey Snyder, Jinn P. Chu

*Corresponding author for this work

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3 Scopus citations

Abstract

The thin film metallic glass (TFMG) is an effective diffusion barrier layer for PbTe-based thermoelectric (TE) modules. Reaction couples structured with Cu/TFMG/PbTe are prepared via sputter-deposition and are annealed at 673 K for 8-96 h. The transmission line method is adopted for the assessment of electrical contact resistivity upon the PbTe/TFMG, and the value remains in the range of 3.3-2.5 × 10 −9 (Ω m 2 ). The titanium-based TFMG remains amorphous upon annealing at 673 K for 48 h and effectively blocks the inter-diffusion by not having grain-boundaries, which only allows the bulk diffusion between the metal electrode and the TE substrate.

Original languageEnglish
Article number013001
JournalAPL Materials
Volume7
Issue number1
DOIs
StatePublished - 1 Jan 2019

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    Yu, C. C., Wu, H-J., Agne, M. T., Witting, I. T., Deng, P. Y., Snyder, G. J., & Chu, J. P. (2019). Titanium-based thin film metallic glass as diffusion barrier layer for PbTe-based thermoelectric modules. APL Materials, 7(1), [013001]. https://doi.org/10.1063/1.5046826