Tin whisker growth driven by electrical currents

S. H. Liu*, Chih Chen, P. C. Liu, T. Chou

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

77 Scopus citations


The growth of tin whiskers in pure Sn was studied using Blech structure. The electromigration behavior in pure tin, in which 5000 Å tin strips were on 700 Å titanium films were also investigated. It was found that the tin whiskers grew on the anode side, while voids were observed on the cathode side after stressing at the current densities of 7.5×10 4 and 1.5×10 5 A/cm 2 at room temperature and 50°C. A mechanism of growth of tin whiskers driven by electrical force was proposed.

Original languageEnglish
Pages (from-to)7742-7747
Number of pages6
JournalJournal of Applied Physics
Issue number12
StatePublished - 15 Jun 2004

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