Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins

Luhua Xu*, Pradeep Dixit, Jianmin Miao, John H L Pang, Xi Zhang, King-Ning Tu, Robert Preisser

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

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Physics & Astronomy