Through-silicon-via-based double-side integrated microsystem for neural sensing applications

Chih Wei Chang*, Po-Tsang Huang, Lei Chun Chou, Shang Lin Wu, Shih Wei Lee, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen Chi Lee, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

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Chemical Compounds

Engineering & Materials Science