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Through-silicon-via-based double-side integrated microsystem for neural sensing applications
Chih Wei Chang*, Po-Tsang Huang, Lei Chun Chou, Shang Lin Wu, Shih Wei Lee, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen Chi Lee, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review