Through-silicon-via-based double-side integrated microsystem for neural sensing applications

Chih Wei Chang*, Po-Tsang Huang, Lei Chun Chou, Shang Lin Wu, Shih Wei Lee, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen Chi Lee, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Scopus citations

Abstract

Highly integrated and miniaturized neural sensing microsystems that provide stable observation, small form factor and biocompatible properties are crucial for brain function investigation and neural prostheses realization for capturing accurate signals from an untethered subject in his natural habitat [1, 2]. Such biomedical devices usually comprise sensors and CMOS circuits for biopotential acquisition, signal conditioning, processing and transmission. Many approaches have been reported, including stacked multichip [3, 4], microsystem with separated neural sensors [5] and monolithic packaged microsystem [6]. Regardless of the integration schemes, the collected weak signals from the sensor need to pass through a string of interconnections including wire bonding, flip-chip bonding and welding or soldering bonds to the processing circuits. The excessive interfaces and connections introduce noise and lead to bulky packaged systems.

Original languageEnglish
Title of host publication2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers
Pages102-103
Number of pages2
DOIs
StatePublished - 29 Apr 2013
Event2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013 - San Francisco, CA, United States
Duration: 17 Feb 201321 Feb 2013

Publication series

NameDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Volume56
ISSN (Print)0193-6530

Conference

Conference2013 60th IEEE International Solid-State Circuits Conference, ISSCC 2013
CountryUnited States
CitySan Francisco, CA
Period17/02/1321/02/13

Fingerprint Dive into the research topics of 'Through-silicon-via-based double-side integrated microsystem for neural sensing applications'. Together they form a unique fingerprint.

  • Cite this

    Chang, C. W., Huang, P-T., Chou, L. C., Wu, S. L., Lee, S. W., Chuang, C. T., Chen, K-N., Chiou, J-C., Hwang, W., Lee, Y. C., Wu, C. H., Chen, K. H., Chiu, C. T., & Tong, H. M. (2013). Through-silicon-via-based double-side integrated microsystem for neural sensing applications. In 2013 IEEE International Solid-State Circuits Conference, ISSCC 2013 - Digest of Technical Papers (pp. 102-103). [6487655] (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 56). https://doi.org/10.1109/ISSCC.2013.6487655