Threshold current density of electromigration in eutectic SnPb solder

Y. T. Yeh, C. K. Chou, Y. C. Hsu, Chih Chen*, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

44 Scopus citations


Electromigration has emerged as an important reliability issue in the microelectronics packaging industry since the dimension of solder joints has continued to shrink. In this letter, we report a technique that enables the precise measurement of the important parameters of solder electromigration, such as activation energy, critical length, threshold current density, effective charge numbers, and electromigration rate. Patterned CuTi films in a Si trench were employed for eutectic SnPb solder to be reflowed on, and thus solder Blech specimens were fabricated. Atomic force microscope was used to measure the depletion volume caused by electromigration on the cathode end. The threshold current density is estimated to be 8.5× 103 A cm2 at 100°C, which relates directly to the maximum allowable current that a solder joint can carry without electromigration damage. This technique facilitates the scientifically systematic investigation of electromigration in solders.

Original languageEnglish
Article number203504
Pages (from-to)1-3
Number of pages3
JournalApplied Physics Letters
Issue number20
StatePublished - 16 May 2005

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