Thin-film composite materials as a dielectric layer for flexible metal-insulator-metal capacitors

Jitendra N. Tiwari, Jagan Singh Meena, Chung Shu Wu, Rajanish N. Tiwari, Min Ching Chu, Feng Chih Chang, Fu-Hsiang Ko*

*Corresponding author for this work

Research output: Contribution to journalArticle

13 Scopus citations

Abstract

A new organic-organic nanoscale composite thin-film (NCTF) dielectric has been synthesized by solution deposition of 1-bromoadamantane and triblock copolymer (Pluronic P123, BASF, EO20-PO70-EO 20), in which the precursor solution has been achieved with organic additives. We have used a sol-gel process to make a metal-insulator-metal capacitor (MIM) comprising a nanoscale (10 nm-thick) thin-film on a flexible polyimide (PI) substrate at room temperature. Scanning electron microscope and atomic force microscope revealed that the deposited NCTFs were crack-free, uniform, highly resistant to moisture absorption, and well adhered on the Au-Cr/PI. The electrical properties of 1-bromoadamantane-P123 NCTF were characterized by dielectric constant, capacitance, and leakage current measurements. The 1-bromoadamantane-P123 NCTF on the PI substrate showed a low leakage current density of 5.5Ã - 10-11cm-2 and good capacitance of 2.4 F at 1 MHz. In addition, the calculated dielectric constant of 1-bromoadamantane-P123 NCTF was 1.9, making them suitable candidates for use in future flexible electronic devices as a stable intermetal dielectric. The electrical insulating properties of 1-bromoadamantane-P123 NCTF have been improved due to the optimized dipole moments of the van der Waals interactions.

Original languageEnglish
Pages (from-to)1051-1056
Number of pages6
JournalChemSusChem
Volume3
Issue number9
DOIs
StatePublished - 24 Sep 2010

Keywords

  • block copolymers
  • green chemistry
  • nanotechnology
  • sol gel processes
  • thin films

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    Tiwari, J. N., Meena, J. S., Wu, C. S., Tiwari, R. N., Chu, M. C., Chang, F. C., & Ko, F-H. (2010). Thin-film composite materials as a dielectric layer for flexible metal-insulator-metal capacitors. ChemSusChem, 3(9), 1051-1056. https://doi.org/10.1002/cssc.201000118