THIN ALLOY FILMS FOR METALLIZATION IN MICROELECTRONIC DEVICES.

King-Ning Tu*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

The so-called ″submicron structure″ is the measure of lateral and vertical dimensions of circuit units such as contacts, gates, and interconnecting lines made mostly of metallic films on semiconductors. In most thin-film multilayered structures used in present devices, each layer is typically a pure metal film. When several of them are stacked together by sequential deposition, the structure is unstable, so interdiffusion and reactions will occur between neighboring layers. The stability of multilayered structures must be improved. H is shown that the use of alloys seems to solve the instability problems.

Original languageEnglish
Pages (from-to)237-282
Number of pages46
JournalTreatise on Materials Science and Technology
Volume24
DOIs
StatePublished - 1 Jan 1982

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