Thermomigration in SnPb composite flip chip solder joints

Annie T. Huang*, A. M. Gusak, King-Ning Tu, Yi Shao Lai

*Corresponding author for this work

Research output: Contribution to journalArticle

134 Scopus citations

Abstract

We have used composite flip chip solder joints to study thermomigration. The composite solder joint has 97Pb3Sn on the Si side and eutectic 37Pb63Sn on the substrate side. Redistribution of Sn and Pb occurs in thermomigration, and we found that Sn has moved to the Si side (the hot end) and Pb to the substrate side (the cold end). We estimate the driving force that a temperature gradient of 1000 °Ccm or a temperature difference of 10 °C across a solder joint of 100 μm in diameter is sufficient to induce the thermomigration.

Original languageEnglish
Article number141911
JournalApplied Physics Letters
Volume88
Issue number14
DOIs
StatePublished - 3 Apr 2006

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