Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

Tian Tian*, King-Ning Tu, Hsiao Yun Chen, Hsiang Yao Hsiao, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

Original languageEnglish
Title of host publicationLead-free Solders
Subtitle of host publicationMaterials Reliability for Electronics
PublisherWiley Blackwell
Pages424-442
Number of pages19
ISBN (Electronic)9780470971826
ISBN (Print)9781119966203
DOIs
StatePublished - 15 Mar 2012

Keywords

  • 3D FEA, in solder bumps
  • Pb free thermomigration
  • Soret effect
  • TM, and reliability problem
  • Thermomigration in SnPb
  • Thermomigration issues

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