Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature

Jie An Lin*, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

To investigate the thermomigration issue in flip-chip solder bumps, eutectic SnPb solder joints with typical dimensions were adopted. To observe the temperature distribution in solder joint during current stressing, infrared microscopy was employed. The bumps were powered by a desired current. Then temperature measurement was performed to record the temperature distribution (map) at the steady state. The temperatures in the solder joints were mapped by a QFI thermal infrared microscope. Solder joints were stressed at 1.88 Amp at room temperature for 3, 6 and 10 hours, respectively. An alternating current (AC) is employed to distinguish electromigration and thermomigration effects. The changes in the intermetallic compound (IMC) microstructure were observed with scanning electron microscope (SEM) under thermomigrationt. In this study, IMC formation plays an important role at solder joint during thermomigration phenomenon at room temperature. As stress time increased, IMC grew thicker rapidly. The IMC is thickening at the hot side is a result of temperature and diffusion driving forces.

Original languageEnglish
Title of host publication2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings
Pages320-322
Number of pages3
DOIs
StatePublished - 1 Dec 2012
Event2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Taipei, Taiwan
Duration: 24 Oct 201226 Oct 2012

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Conference

Conference2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012
CountryTaiwan
CityTaipei
Period24/10/1226/10/12

Fingerprint Dive into the research topics of 'Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature'. Together they form a unique fingerprint.

  • Cite this

    Lin, J. A., & Chen, C. (2012). Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature. In 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings (pp. 320-322). [6420297] (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT). https://doi.org/10.1109/IMPACT.2012.6420297