Thermomagnetic Micro-Tracks-Guided Magnetic Bead Manipulation: A Demonstration of Moving Bead Across Different Tracks Enabled by Novel Embedded on-Chip Micro Heating Wires

Lin Huei Fang, Hao Duan, Chin Chung Chen, Chin Cheng Cheng, Tien Kan Chung

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we show a demonstration of moving bead across different tracks enabled by novel embedded on-chip micro heating wires for thermomagnetic micro-tracks-guided magnetic bead manipulation. The demonstration includes a magnetic-bead-manipulation chip (which consists of thermomagnetic NiCu micro-disk tracks deposited on top of on-chip platinum micro heating wires fabricated on top of a silicon substrate), a magnetic bead, a thermoelectric generator (TEG), a pulse-generation circuit, and four external electromagnets. Because curie temperature of the track is approximate in room-temperature range, when we apply a pulse current to the heating wires to individually heat the track higher than room temperature, the magnetic property of the track is switched to paramagnetic. Oppositely, when we apply a current to TEG to cool the track lower than room temperature, the track is switched to ferromagnetic. By sequentially/selectively heating or cooling the tracks to switch the tracks to paramagnetic or ferromagnetic, together with applying directional magnetic field, we can achieve moving bead across different NiCu micro-disk tracks. This is an important and significant progress for conventional thermomagnetic micro-tracks-guided magnetic bead manipulation which cannot demonstrate moving bead across different tracks. Therefore, our approach provides a new and complete thermomagnetic micro-tracks-guided magnetic bead manipulation for lab-on-chip micro systems and biomedical MEMS/NEMS.

Original languageEnglish
Title of host publication2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems, MEMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1033-1036
Number of pages4
ISBN (Electronic)9781728116105
DOIs
StatePublished - Jan 2019
Event32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019 - Seoul, Korea, Republic of
Duration: 27 Jan 201931 Jan 2019

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2019-January
ISSN (Print)1084-6999

Conference

Conference32nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2019
CountryKorea, Republic of
CitySeoul
Period27/01/1931/01/19

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