Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers

Kuan-Neng Chen*, Chuan Seng Tan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapter

8 Scopus citations
Original languageEnglish
Title of host publicationHandbook of Wafer Bonding
PublisherWiley-VCH
Pages161-180
Number of pages20
ISBN (Print)9783527326464
DOIs
StatePublished - 8 Feb 2012

Keywords

  • Copper
  • Cu
  • Thermocompression
  • Wafer bonding

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