Thermo-electromigration induced failure in WL-CSP Pb-free solder joints

Luhua Xu, Shih Wei Liang, Di Xu, King-Ning Tu, Stephen Gee, Luu Nguyen, Marshall Andrews

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

• Failure mode is due to pancake void formation. The interfacial IMCs are dissolved during the void growth at the interface. The remaining IMC thickness depends on the location as the current re-distribution depends on the location. The location of the void are different for different UBM. • Ti/Cu/Cu (thick Cu): at IMC/solder interface • e-less NiAu: at Ni(IMC)/solder interface, IMC dissolved • Al/Ni(V)/Cu: at UBM/solder interface, IMC dissolved • Need more experimental to separate thermal gradient effect and electron wind effect.

Original languageEnglish
Title of host publicationInternational Conference and Exhibition on Device Packaging 2009
Pages2776-2811
Number of pages36
StatePublished - 1 Dec 2008
EventInternational Conference and Exhibition on Device Packaging 2009 - Scottsdale/Fountain Hills, AZ, United States
Duration: 9 Mar 200912 Mar 2009

Publication series

NameInternational Conference and Exhibition on Device Packaging 2009
Volume5

Conference

ConferenceInternational Conference and Exhibition on Device Packaging 2009
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period9/03/0912/03/09

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  • Cite this

    Xu, L., Liang, S. W., Xu, D., Tu, K-N., Gee, S., Nguyen, L., & Andrews, M. (2008). Thermo-electromigration induced failure in WL-CSP Pb-free solder joints. In International Conference and Exhibition on Device Packaging 2009 (pp. 2776-2811). (International Conference and Exhibition on Device Packaging 2009; Vol. 5).