Thermal switch and variable capacitance designed for micro electrostatic converter by using CMOS MEMS process

Jin-Chern Chiou*, Lei Chun Chou, You Liang Lai, Sheng-Chieh Huang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper focuses on implementing a novel thermal switch and variable capacitance design by using commercially available CMOS MEMS process which can approach in a micro electrostatic converter system. In this system, there are two major parts. First is the variable capacitance, and the second is the thermal switch. In the variable capacitance, it implement by UMC 0.18μm one-poly seven-metal (1P7M) CMOS MEMS process. In the post-process, the silicon-oxidation have been released and the gap between two metal layers filled with PDMS (Polydimethylsiloxane). Filling with PDMS is to significantly increase C max.

Original languageEnglish
Title of host publication2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages733-737
Number of pages5
DOIs
StatePublished - 1 Jun 2012
Event7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
Duration: 5 Mar 20128 Mar 2012

Publication series

Name2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Conference

Conference7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
CountryJapan
CityKyoto
Period5/03/128/03/12

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