Thermal modeling and design on smartphones with heat pipe cooling technique

Hong Wen Chiou, Yu-Min Lee, Hsuan Hsuan Hsiao, Liang Chia Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

While the performance of smartphones becomes much higher, the application processor consumes considerable power. Thus, it is hard to meet thermal constraints by using conventional cooling techniques. Fortunately, since heat pipes can efficiently transfer the thermal energy from hot regions to cool regions, temperatures in hot regions can be reduced greatly. Hence, in the past three years, the heat pipe cooling techniques have been applied to smartphones by industries. However, although the time-consuming commercial simulation tools, such as ANSYS Fluent, can provide accurate thermal maps, they may lead to inefficiency during design stages. Besides, the compact thermal model for bended heat pipes is still underdeveloped. Therefore, efficient thermal simulation for smartphones with bended heat pipes should be developed for the design stage. Furthermore, the routing of bended heat pipe should be optimized to obtain more thermal energy transfer.

Original languageEnglish
Title of host publication2017 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages482-489
Number of pages8
ISBN (Electronic)9781538630938
DOIs
StatePublished - 13 Dec 2017
Event36th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017 - Irvine, United States
Duration: 13 Nov 201716 Nov 2017

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
Volume2017-November
ISSN (Print)1092-3152

Conference

Conference36th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2017
CountryUnited States
CityIrvine
Period13/11/1716/11/17

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