Thermal management of a motor drive power module by liquid impingement cooling

Avijit Bhunia*, Qingjun Cai, Chung-Lung Chen

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

1 Scopus citations


Thermal management of a 600V 25 A power module by liquid jet impingement is investigated. Experiments are conducted on a module with resistive heat sources mimicking heat dissipation from IGBTs and diodes. An array of 36 DI water jets, 145 - 200μm diameter, impinging on the base plate of the module, demonstrates a 3X and 4X enhancement of the heat dissipation capability compared to the traditional cold plate and air-cooled heat sink, respectively. If the power level is held constant, the device junction temperature is reduced by a factor of 3X. At a reduced system pressure (13% atmospheric), an efficient jet impingement boiling on the base plate leads to a device level (1cm 2 area) power density of 230W/cm 2. The corresponding module volumetric power density is 12MW/m 3, about 4X of water-cooled cold plate. Numerical simulations show that the liquid impingement cooling technique has potential to enhance the module output rating from its current level of 5.2KW to ∼20KW and ∼62KW, respectively, for silicon and silicon carbide devices.

Original languageEnglish
Number of pages9
StatePublished - 1 Jul 2004
Event42nd AIAA Aerospace Sciences Meeting and Exhibit - Reno, NV, United States
Duration: 5 Jan 20048 Jan 2004


Conference42nd AIAA Aerospace Sciences Meeting and Exhibit
CountryUnited States
CityReno, NV

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