Thermal management design from chip to package for high power InGaN/sapphire LEDs applications

Ray-Hua Horng, C. C. Chiang, D. S. Wuu, H. I. Lin, Y. L. Tsai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The optical and thermal properties of blue InGaN/sapphire LEDs with a novel structure design for heat dissipation is investigated. The LED chip is designed to directly contact with a cup-shaped Cu heat spreader, and then mounted on a heat sink coated with a diamond-like film. The packaged LED chip with the novel heat dissipation design demonstrates superior light output power and reduced junction temperature as compared with the same LED chip packaged using conventional process.

Original languageEnglish
Title of host publicationECS Transactions - State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9
Pages111-115
Number of pages5
Edition7
DOIs
StatePublished - 1 Dec 2008
EventState-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9 - 214th ECS Meeting - Honolulu, HI, United States
Duration: 12 Oct 200817 Oct 2008

Publication series

NameECS Transactions
Number7
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceState-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9 - 214th ECS Meeting
CountryUnited States
CityHonolulu, HI
Period12/10/0817/10/08

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    Horng, R-H., Chiang, C. C., Wuu, D. S., Lin, H. I., & Tsai, Y. L. (2008). Thermal management design from chip to package for high power InGaN/sapphire LEDs applications. In ECS Transactions - State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9 (7 ed., pp. 111-115). (ECS Transactions; Vol. 16, No. 7). https://doi.org/10.1149/1.2983165