@inproceedings{84a6cb4fbc7c4b14a637ecf5ba74da90,
title = "Thermal management design from chip to package for high power InGaN/sapphire LEDs applications",
abstract = "The optical and thermal properties of blue InGaN/sapphire LEDs with a novel structure design for heat dissipation is investigated. The LED chip is designed to directly contact with a cup-shaped Cu heat spreader, and then mounted on a heat sink coated with a diamond-like film. The packaged LED chip with the novel heat dissipation design demonstrates superior light output power and reduced junction temperature as compared with the same LED chip packaged using conventional process.",
author = "Ray-Hua Horng and Chiang, {C. C.} and Wuu, {D. S.} and Lin, {H. I.} and Tsai, {Y. L.}",
year = "2008",
month = dec,
day = "1",
doi = "10.1149/1.2983165",
language = "English",
isbn = "9781566776530",
series = "ECS Transactions",
number = "7",
pages = "111--115",
booktitle = "ECS Transactions - State-of-the-Art Program on Compound Semiconductors 49 (SOTAPOCS 49) -and- Nitrides and Wide-Bandgap Semiconductors for Sensors, Photonics, and Electronics 9",
edition = "7",
note = "null ; Conference date: 12-10-2008 Through 17-10-2008",
}