Thermal gradient in solder joints under electrical current stressing

Da Jeng Yao*, Chung Yi Hsu, Chih Chen, Sheng Hsiang Chiu

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Thermal gradient phenomena in SnAg 3.5 solder joints under high current density operating were both acquired from whole device simulation and observed from experiments. A series of structural solder bump models were created and simulated by finite element software under different current density. The thermal gradient and temperature increasing were investigated under current stressing of 10 3 A/cm 2 to 10 4 A/cm 2 at 70°C by infrared microscopy. The magnitude of the thermal gradient is increased by increasing the applied current. The measured temperature increase due to Joule heating is as high as 55.9°C, and the thermal gradient reached 333°C/cm when stressed by 10 4 A/cm 2 , yet only 8.3°C temperature increased and the thermal gradient reached 83°C/cm when stressed by 10 3 A/cm 2 . The temperature increasing in this model is 53.1°C and thermal gradient in the solder is 168°C/cm under 10 4 A/cm 2 current stressing, yet only 10.4°C temperature increased and thermal gradient decreased to 35°C/cm under 10 3 A/cm 2 . After verification, only less than 0.5% error is achieved between simulation results and experiment results. It proves this built model can be used to project thermal characteristic of different module designs.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1277-1282
Number of pages6
DOIs
StatePublished - 1 Dec 2005
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 17 Jul 200522 Jul 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART B

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

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