Thermal-flow techniques for sub-35 nm contact-hole fabrication in electron-beam lithography

H. L. Chen*, C. H. Chen, Fu-Hsiang Ko, T. C. Chu, C. T. Pan, Horng-Chih Lin

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The chemically amplified deep-ultraviolet resist UV-135 for application in high-resolution electron-beam lithography was characterized. The thermal-flow technique for sub-35 nm contact-hole fabrication by electron-beam lithography was established. The optimal thermal-flow temperature was determined by DSC and WCM methods.

Original languageEnglish
Pages (from-to)2973-2978
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume20
Issue number6
DOIs
StatePublished - 1 Nov 2002

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