The chemically amplified deep-ultraviolet resist UV-135 for application in high-resolution electron-beam lithography was characterized. The thermal-flow technique for sub-35 nm contact-hole fabrication by electron-beam lithography was established. The optimal thermal-flow temperature was determined by DSC and WCM methods.
|Number of pages||6|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - 1 Nov 2002|