Thermal-driven analog placement considering device matching

Po-Hung Lin*, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

24 Scopus citations

Abstract

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

Original languageEnglish
Title of host publication2009 46th ACM/IEEE Design Automation Conference, DAC 2009
Pages593-598
Number of pages6
DOIs
StatePublished - 10 Nov 2009
Event2009 46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, CA, United States
Duration: 26 Jul 200931 Jul 2009

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Conference

Conference2009 46th ACM/IEEE Design Automation Conference, DAC 2009
CountryUnited States
CitySan Francisco, CA
Period26/07/0931/07/09

Keywords

  • Analog placement
  • Thermal matching

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