Thermal-driven analog placement considering device matching

Po-Hung Lin*, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

20 Scopus citations


With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

Original languageEnglish
Title of host publication2009 46th ACM/IEEE Design Automation Conference, DAC 2009
Number of pages6
StatePublished - 10 Nov 2009
Event2009 46th ACM/IEEE Design Automation Conference, DAC 2009 - San Francisco, CA, United States
Duration: 26 Jul 200931 Jul 2009

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X


Conference2009 46th ACM/IEEE Design Automation Conference, DAC 2009
CountryUnited States
CitySan Francisco, CA


  • Analog placement
  • Thermal matching

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    Lin, P-H., Zhang, H., Wong, M. D. F., & Chang, Y. W. (2009). Thermal-driven analog placement considering device matching. In 2009 46th ACM/IEEE Design Automation Conference, DAC 2009 (pp. 593-598). [5227072] (Proceedings - Design Automation Conference).