Thermal diffusivity, heat capacity and thermal conductivity in Al 2 O 3 Ni composite

Dean-Mo LIu*, W. H. Tuan, Chien Chia Chiu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

22 Scopus citations


Thermal diffusivity, heat capacity, and thermal conductivity of Al 2 O 3 Ni composite with 5 vol.% of Ni particulate were investigated. The thermal conductivity of the composite increases monotonically with increase of Ni particle size, and approaches a limiting value for Ni particles of 2 μm or larger. The reduced conductivity at smaller particle sizes is due primarily to the increased interfacial resistance related to the increase of Al 2 O 3 /Ni contact area, even though metal Ni has higher value of thermal conductivity than that of Al 2 O 3 . The mode of heat conduction in the composite with the smallest Ni particulate, i.e. D = 0.1 μm, is a result of both phonons and interfacial defects, and this leads of the composite characterizing with a lower temperature-dependent thermal conductivity. The Kapitza radius of the composite was experimentally determined as approximately 0.6-0.7 μm, at which the Ni conductivity is balanced by interfacial resistance, resulting in composite conductivity = matrix conductivity. This suggests that a minimum Ni particle size of ∼ 1.4 μm is essentially required for the improvement of the overall thermal conductivity in Al 2 O 3 Ni composite.

Original languageEnglish
Pages (from-to)287-291
Number of pages5
JournalMaterials Science and Engineering B
Issue number3
StatePublished - 1 Jan 1995


  • Al O
  • Phonon-phonon interaction
  • Thermal conductivity
  • Thermal diffusivity

Fingerprint Dive into the research topics of 'Thermal diffusivity, heat capacity and thermal conductivity in Al <sub>2</sub> O <sub>3</sub> Ni composite'. Together they form a unique fingerprint.

Cite this