Thermal conductance of biporous evaporator wicks in thin film evaporation and boiling regimes

Vinod Srinivasan*, Ming-Chang Lu, Dusan Coso, Arun Majumdar

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We present detailed data on the performance of microstructured geometries for use in the evaporator section of a vapor chamber heat pipe. The central innovation of the geometries is their hierarchical structure, involving the use of large microchannels in order to reduce liquid flow drag while fabricating microscale pin fin arrays whose small pores increase capillary suction. The overall conductance in such a geometry is dependent on the extent of thin liquid film (thickness ∼few microns), which is manipulated by increasing the surface area-to-volume ratio through the use of microstructuring. Experiments were conducted for a heater area of 1cm 2 , with the wick in a vertical orientation. Results are presented for fixed microchannel widths of 30-60 microns, with pin fin diameters ranging from 4 to 32 microns, and pin fin array widths of 150 to 300 microns. The competing effects of increase in surface area due to microstructuring, and the suppression of evaporation due to reduction in pore scale are explored. In the evaporative regime, conductances of the order of 6 W/cm 2 -K are attained at heat fluxes of up to 140 W/cm 2 , until the capillary limit is reached and the wick dries out.

Original languageEnglish
Title of host publication2010 14th International Heat Transfer Conference, IHTC 14
Pages401-409
Number of pages9
DOIs
StatePublished - 1 Dec 2010
Event2010 14th International Heat Transfer Conference, IHTC 14 - Washington, DC, United States
Duration: 8 Aug 201013 Aug 2010

Publication series

Name2010 14th International Heat Transfer Conference, IHTC 14
Volume5

Conference

Conference2010 14th International Heat Transfer Conference, IHTC 14
CountryUnited States
CityWashington, DC
Period8/08/1013/08/10

Fingerprint Dive into the research topics of 'Thermal conductance of biporous evaporator wicks in thin film evaporation and boiling regimes'. Together they form a unique fingerprint.

  • Cite this

    Srinivasan, V., Lu, M-C., Coso, D., & Majumdar, A. (2010). Thermal conductance of biporous evaporator wicks in thin film evaporation and boiling regimes. In 2010 14th International Heat Transfer Conference, IHTC 14 (pp. 401-409). (2010 14th International Heat Transfer Conference, IHTC 14; Vol. 5). https://doi.org/10.1115/IHTC14-22730