@inproceedings{69b0840fd1774dd7951120271216152c,
title = "Thermal-aware memory management unit of 3D-stacked DRAM for 3D high definition (HD) video",
abstract = "With the increasing resolution of 3D high definition (HD) video, high bandwidth, large capability, low power memory becomes essential. In this paper, a thermal-aware hierarchal memory management unit (MMU) in a 3D-Stacked DRAM model is proposed for 3D HD video systems. By constructing the 4Gb, 4-stack 3D DDR3 DRAM model with through-silicon-vias (TSVs), the data bandwidth can be up to 21.3 GB/s @ 333MHz. Additionally, an efficient address translator, a global rank controller and local slice controllers are proposed in the hierarchal MMU for 3D Full HD video disparity calculation. The hierarchal MMU can improve bandwidth by 54.3% through command reordering and bank/rank interleaving. Moreover, power reduction of up to 43.46% can be realized in low power mode by the dynamic thermal-aware refresh timing control and deep power down detection.",
author = "Chang, {Chih Yuan} and Po-Tsang Huang and Chen, {Yi Chun} and Tian-Sheuan Chang and Wei Hwang",
year = "2014",
month = nov,
day = "5",
doi = "10.1109/SOCC.2014.6948903",
language = "English",
series = "International System on Chip Conference",
publisher = "IEEE Computer Society",
pages = "76--81",
editor = "Ramalingam Sridhar and Danella Zhao and Kaijian Shi and Thomas Buchner",
booktitle = "International System on Chip Conference",
address = "United States",
note = "null ; Conference date: 02-09-2014 Through 05-09-2014",
}