A thermal analysis tool developed for laminar, narrow gap parallel plate heatsink with various topologies such as side inlet and side outlet (SISO), top inlet and side outlet(TISO) or arbitrary location of inlet and side outlet is presented and examined. For simple topologies, the software has been validated with known exact solutions and CFD results. The fan curves and prescribed heat flux at base plate are incorporated into the software. Current analysis software combined with graphic used interface, visualization tools have been demonstrated to be a useful, fast, and friendly tool for parametric design studies.
|Number of pages||4|
|State||Published - 1 Jan 1998|
|Event||Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA|
Duration: 27 May 1998 → 30 May 1998
|Conference||Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM|
|City||Seattle, WA, USA|
|Period||27/05/98 → 30/05/98|