Thermal analysis design tool for parallel plate heatsinks

Chung-Lung Chen*, Kim Peppi, Scott Day, C. Liao

*Corresponding author for this work

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

A thermal analysis tool developed for laminar, narrow gap parallel plate heatsink with various topologies such as side inlet and side outlet (SISO), top inlet and side outlet(TISO) or arbitrary location of inlet and side outlet is presented and examined. For simple topologies, the software has been validated with known exact solutions and CFD results. The fan curves and prescribed heat flux at base plate are incorporated into the software. Current analysis software combined with graphic used interface, visualization tools have been demonstrated to be a useful, fast, and friendly tool for parametric design studies.

Original languageEnglish
Pages371-374
Number of pages4
DOIs
StatePublished - 1 Jan 1998
EventProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM - Seattle, WA, USA
Duration: 27 May 199830 May 1998

Conference

ConferenceProceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
CitySeattle, WA, USA
Period27/05/9830/05/98

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    Chen, C-L., Peppi, K., Day, S., & Liao, C. (1998). Thermal analysis design tool for parallel plate heatsinks. 371-374. Paper presented at Proceedings of the 1998 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, Seattle, WA, USA, . https://doi.org/10.1109/ITHERM.1998.689589