Thermal analysis and design for power electronics of integrated motor

C. M. Liao*, Chung-Lung Chen

*Corresponding author for this work

Research output: Contribution to journalConference article

3 Scopus citations

Abstract

Electronic package for integrated motors is studied in this paper. To make the integrated motor more compact, the power electronic package is set in front of motor fancover. The integrated motor is designed to operate at the ambient temperature 90°C or higher. CFD is used for thermal and flow analysis to optimizing the thermal performance. To cut design cycle time, the thermal analyses are carried out in three stages. The first is motor frame calculation; the second is calculations for the electronic package optimization design; the last is the whole integrated motor calculations. Both natural and convective flow and heat transfer occur in the package. The capacitors are set near the housing grill to avoid high temperature. Housing vents can reduce the highest temperature by about 13°C. The IGBT subpackage is also optimized with thermal analysis at the chip level. Two-side cooling technology is used for commercially available IGBT cooling. Comparing two-side cooling with one-side cooling with the same baseplate heat sink, the temperature is reduced 10°C on the silicon base of IGBT. An additional heat spreader on the front side and a small fin on base-plate side can cut the surface temperature by another 13°C. The electronic package final design electronic package was successfully tested under 90°C for 1.5 hours.

Original languageEnglish
Pages (from-to)408-414
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3906
StatePublished - 1 Dec 1999
EventProceedings of the 1999 International Symposium on Microelectronics - Chicago, IL, USA
Duration: 26 Oct 199928 Oct 1999

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