Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"

Ming Yao Chen*, Chao Chyun An, Shyh Ming Chang, Kuo Shu Kao, Jimmy Tsang, Sheng Shu Yang, Chih Chen, Chung Kuang Lin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Non-Conductive-Film (NCF) bonding method ensures the micro-order direct bonding between the IC electrode and circuit substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the substrate. The stress analysis results are used to identify the appropriate temperature range for the given NCF bonding structure. Both analytical and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress and low, and stable connection resistance at various environmental temperatures. In addition, the reliability test results will be discussed.

Original languageEnglish
Title of host publication9th Electronics Packaging Technology Conference, EPTC 2007
Pages71-74
Number of pages4
DOIs
StatePublished - 1 Dec 2007
Event9th Electronics Packaging Technology Conference, EPTC 2007 - , Singapore
Duration: 12 Dec 200712 Dec 2007

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Conference

Conference9th Electronics Packaging Technology Conference, EPTC 2007
CountrySingapore
Period12/12/0712/12/07

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