The power of functional scaling: Beyond the power consumption challenge and the scaling roadmap

Albert Chin*, Séan P. McAlister

*Corresponding author for this work

Research output: Contribution to journalArticle

15 Scopus citations

Abstract

The increases in the densities of devices and their functionality in circuits are making the issue of power dissipation, both static and dynamic, a serious constraint to future scaling advances. 3-D integration of novel Ge-based devices with standard Si devices is shown to provide potential ways to address the dc and ac power consumption issues in advanced ICs. Advantages of this scheme include low processing temperature and excellent lattice-match with GaAs.

Original languageEnglish
Pages (from-to)27-35
Number of pages9
JournalIEEE Circuits and Devices Magazine
Volume21
Issue number1
DOIs
StatePublished - 1 Jan 2005

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