The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

W. M. Chen, T. L. Yang, C. K. Chung, C. R. Kao

Research output: Contribution to journalArticlepeer-review

26 Scopus citations

Abstract

The preferred orientation growth of intermetallic compounds is becoming an increasingly important issue, due to recent advances in three-dimensional integrated circuits. This study reveals that Cu6Sn5 that is formed on Ni does not grow in random orientations, but exhibits a pronounced preferred orientation relationship. This relationship is identified as (12̄0)(Cu,Ni)6Sn5(11̄1)Niand[001](Cu, Ni)6Sn5[110]Ni, according to electron backscatter diffraction and high-resolution transmission electron microscopy analysis. One critical implication is that no Ni3Sn4 exists between Cu6Sn5 and Ni because the Cu 6Sn5/Ni interface is coherent.

Original languageEnglish
Pages (from-to)331-334
Number of pages4
JournalScripta Materialia
Volume65
Issue number4
DOIs
StatePublished - Aug 2011

Keywords

  • Intermetallic compounds
  • Orientation issues
  • Soldering reaction
  • Textured morphology

Fingerprint Dive into the research topics of 'The orientation relationship between Ni and Cu<sub>6</sub>Sn<sub>5</sub> formed during the soldering reaction'. Together they form a unique fingerprint.

Cite this