The microstructure and mechanical property of the high entropy alloy as a low temperature solder

Li Pu, Quanfeng He, Yong Yang, Xiuchen Zhao, Zhuangzhuang Hou, K. N. Tu, Yingia Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this paper, we studied the high entropy alloy (HEA) of SnBiInZn as a low temperature solder with a melting point about 80 oC. The microstructure of the HEA solder is very complicated. There are three phases at least in the solder, including Bi-rich phase, Sn-rich phase and InBi phase. The wetting reaction between the solder and Cu substrate was conducted at 100 oC and 120 oC. The wetting angle ranges from 30 to 40 degrees, indicating that the solder has a good wetting ability even at such low soldering temperature. The scallop and finger shape intermetallic compounds were determined to be Cu6Sn5. The thickness measurement of the IMC layer shows that the interfacial reaction rate is very slow. The shear stress ranges from 19 MPa to 28 MPa, which indicates that the solder joint is strong enough for electronic packaging technology.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1716-1721
Number of pages6
ISBN (Electronic)9781728114989
DOIs
StatePublished - May 2019
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2019-May
ISSN (Print)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
CountryUnited States
CityLas Vegas
Period28/05/1931/05/19

Keywords

  • Entropy alloy
  • Intermetallic compound
  • Low temperature solder
  • Microstructure
  • Shear stress

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  • Cite this

    Pu, L., He, Q., Yang, Y., Zhao, X., Hou, Z., Tu, K. N., & Liu, Y. (2019). The microstructure and mechanical property of the high entropy alloy as a low temperature solder. In Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (pp. 1716-1721). [8811294] (Proceedings - Electronic Components and Technology Conference; Vol. 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2019.00263