The investigation of nano-roughening effect on the reliability enhancement of adhesive bond for NEMS manufacture application

Chia Yeh Yang*, Yu-Ting Cheng, Wen-Syang Hsu

*Corresponding author for this work

Research output: Contribution to journalArticle

1 Scopus citations

Abstract

The paper shows the importance of nano-roughening on the bonding interface to the reliability enhancement of adhesive bond for ensuring the continuation of packaging shrinkage from MEMS to NEMS. The roughening is realized via a nonuniformly etching characteristic of PR which is etched and then utilized as an etching mask for following silicon etching process. Ultraviolet adhesive for silicon-to-glass bonding is utilized for the verification of the nano-roughening effect on NEMS hermetic encapsulation. The average roughnesses of the silicon substrate before and after roughening are 0.4 nm and 12.4 nm, respectively. Experimental results show that the roughness increase of silicon substrate can effectively provide more than 30% bonding strength enhancement and 30% leakage reduction. In addition, stamp-and-stick test shows that nano-roughening indeed provides a better adhesive characteristic that can further ensure the success of the stamp-and-stick process for nano/microfabrication.

Original languageEnglish
Article number5405055
Pages (from-to)356-361
Number of pages6
JournalIEEE Transactions on Advanced Packaging
Volume33
Issue number2
DOIs
StatePublished - 1 May 2010

Keywords

  • Hermetic encapsulation
  • Nano-electromechanical systems (NEMS) manufacture
  • Nano-roughening
  • Scaling rule
  • Ultraviolet (UV) adhesive bonding

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