The electromigration investigation of Cu-Ni nanocomposites

Y. C. Chen*, Chia Wei Chu, Tzu Yuan Chao, Yu-Ting Cheng, Chih Chen

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The paper presents the electromigration behavior study of Cu-Ni nanocomposite for low-power electromagnetic microactuator fabrication. The nanocomposite is characterized based the striped with 50μm width and synthesized in the Cu plating bath with the 2g/L concentration of 50nm Ni nanopowders. About 2.03% Ni weight percentage in the Cu-Ni nanocomposite stripe is characterized using inductively coupled plasma mass spectrometer (ICP-MS). The drift velocity, critical length, critical product, and activation energy of the Cu-Ni nanocomposite are 565nm/hr, 14μm, 1714 A/cm, and 0.39eV respectively. In comparison with the values of Cu which are 88nm/hr, 20μm, 2365 A/cm, and 1.09eV, respectively, the poor electromigration behavior of the nanocomposite is dominated by the surface diffusion mechanism of Cu atoms due to the void formation in the interface between itself and the passivation oxide.

Original languageEnglish
Title of host publication2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
Pages515-518
Number of pages4
DOIs
StatePublished - 1 Jun 2012
Event7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012 - Kyoto, Japan
Duration: 5 Mar 20128 Mar 2012

Publication series

Name2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012

Conference

Conference7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2012
CountryJapan
CityKyoto
Period5/03/128/03/12

Keywords

  • Cu-Ni
  • electromigration
  • nanocomposite

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