The application of lead-free solder to optical fiber packaging

Shengquan Ou*, Gu Xu, Yuhuan Xu, King-Ning Tu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

To achieve precise, hermetic, and reliable optoelectronic packaging, we studied a novel technology for bonding fibers to v-grooved chips by metallic soldering. Multilayered metallization of Ti/Au, Ti/Cu/Au, or Ti/Ni/Au has been prepared to improve the poor bonding nature of solder on oxide surface. The eutectic 43Sn57Bi (wt.%) alloy, having a melting point of 139°C, was selected to bond the fibers to v-grooved chips. The alignment and adhesion tests result show that the precision packaging by soldering has a satisfied reliability in the range of working temperature from -40°C to 85°C. The metallic solder bonding is hermetic, and hence, it can isolate the optical device from ambient environment.

Original languageEnglish
Pages (from-to)1440-1444
Number of pages5
JournalJournal of Electronic Materials
Volume33
Issue number12
DOIs
StatePublished - 1 Jan 2004

Keywords

  • Lead-free solder
  • Optical and optoelectronic packaging
  • Optical fiber array
  • V-grooved chips

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