The Advances of OTP Memory for Embedded Applications in HKMG Generation and Beyond

Steve S. Chung*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Current need to the development of advanced 28nm and beyond OTP (One-time-Programmable) nonvolatile memory is limited by the compatibility with advanced nodes with particular high-k metal-gate gate stack feature. On the other hand, there is a strong demand for future use in IoT and AI in security applications. In this talk, we will provide a solution on how to develop a unique structure of OTP for the above purpose. A 4kb macro of One Time Programming (OTP) memory, implemented by a new breakdown, named dielectric fuse (dFuse) breakdown, will be demonstrated which is constructed on a foundry pure logic 28nm HKMG CMOS platform. The feature size of a unit cell is 1.5T per cell with 7.5F2. The experimental results show that dFuse macro exhibits high programming (PGM) speed of 100ns at 4V, read time smaller than 10ns at 0.75V, and excellent data retention under one-month baking at 150°C. More importantly, the program voltage is weakly dependent on the environmental temperature, suitable for automotive applications. This OTP is also expected to be scalable to advanced technology node such as FinFET and provides an ideal and reliable solution for the storage purpose in IoT and 5G era. In particular, it has great potential for embedded applications in MCU, e.g., automotive applications.

Original languageEnglish
Title of host publicationProceedings - 2019 IEEE 13th International Conference on ASIC, ASICON 2019
EditorsFan Ye, Ting-Ao Tang
PublisherIEEE Computer Society
Number of pages4
ISBN (Electronic)9781728107356
DOIs
StatePublished - 29 Oct 2019
Event2019 IEEE 13th International Conference on ASIC - Chongqing, China
Duration: 29 Oct 20192 Nov 2019

Publication series

NameProceedings of International Conference on ASIC
ISSN (Print)2162-7541
ISSN (Electronic)2162-755X

Conference

Conference2019 IEEE 13th International Conference on ASIC
Abbreviated title ASICON
CountryChina
CityChongqing
Period29/10/192/11/19

Keywords

  • OTP
  • Memory

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