Tensile properties and thermal stability of unidirectionally <111>-oriented nanotwinned and <110>-oriented microtwinned copper

Yu Jin Li, King-Ning Tu, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

Tensile tests on two kinds of electroplated copper foils with twins before and after annealing were performed. One electroplating parameter results in a microstructure of <110>-oriented microtwinned Cu (mt-Cu), and the other is <111>-oriented nanotwinned Cu (nt-Cu). The latter shows higher thermal stability than the former after annealing. Though the toughness for the two as-plated foils are quite close, the toughness for the <111> oriented nt-Cu increased from 34 to 74 MJ/m3 after annealing at 250 °C for 3 h. In comparison, the toughness of the <110>-oriented mt-Cu remained almost the same after annealing.

Original languageEnglish
Article number1211
JournalMaterials
Volume13
Issue number5
DOIs
StatePublished - 8 Mar 2020

Keywords

  • Electroplated Cu
  • Nano-twinned Cu
  • Thermal stability
  • Toughness

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