Temperature-dependent memory characteristics of silicon-oxide-nitride-oxide-silicon thin-film-transistors

Shih Ching Chen, Ting Chang Chang, Yung Chun Wu, Jing Yi Chin, Yong En Syu, S. M. Sze, Chun-Yen Chang, Hsing-Hua Wu, Yi Chan Chen

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4 Scopus citations


This study investigates the temperature-dependent memory characteristics of polycrystalline silicon thin-film transistors with oxide/nitride/oxide stack gate dielectrics and N+ poly-Si gate structures for nonvolatile memory application. As the device was programmed by Fowler-Nordheim tunneling at high temperature, some electrons captured in shallow traps could obtain enough thermal energy to de-trap to the gate, resulting in low programming efficiency. As the programming time increases, the hole injection through the blocking oxide from the gate would further lead the threshold voltage to decrease. In addition, the retention characteristic of the device programmed at higher temperature exhibits better charge storage ability. Because the electrons trapped in the shallow traps of the nitride layer can be easily de-trapped when temperature rises, the memory characteristics are mainly dominated by charges stored in the deep traps. (C) 2009 Elsevier B.V. All rights reserved.
Original languageEnglish
Pages (from-to)3999-4002
Number of pages4
JournalThin Solid Films
Issue number14
StatePublished - 3 May 2010


  • Polycrystalline silicon; SONOS; Nonvolatile memory; Thin-film transistor (TFT)

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