Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis

C. K. Lin, Wei An Tsao, Y. C. Liang, Chih Chen*

*Corresponding author for this work

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

Temperature-dependent electromigration failure was investigated in solder joints with Cu metallization at 126°C, 136°C, 158°C, 172°C, and 185°C. At 126°C and 136°C, voids formed at the interface of Cu 6Sn5 intermetallic compounds and the solder layer. However, at temperature 158°C and above, extensive Cu dissolution and thickening of Cu6Sn5 occurred, and few voids were observed. We proposed a model considering the flux divergency at the interface. At temperatures below 131°C, the electromigration flux leaving the interface is larger than the in-coming flux. Yet, the in-coming Cu electromigration flux surpasses the out-going flux at temperatures above 131°C. This model successfully explains the experimental results.

Original languageEnglish
Article number113711
JournalJournal of Applied Physics
Volume114
Issue number11
DOIs
StatePublished - 21 Sep 2013

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