TCAD/Physics-Based Analysis of High-Density Dual-BOX FD/SOI SRAM Cell With Improved Stability

Keunwoo Kim, Jente B. Kuang, Fadi H. Gebara, Hung C. Ngo, Ching-Te Chuang, Kevin J. Nowka

Research output: Contribution to journalArticlepeer-review

6 Scopus citations


This paper presents a new SRAM cell using a global back-gate bias scheme in dual buried-oxide (BOX) FD/SOI CMOS technologies. The scheme uses a single global back-gate bias for all cells in the entire columns or subarray, thereby reducing the area penalty. The scheme improves 6T SRAM standby leakage, read stability, write ability, and read/write performance. The basic concept of the proposed scheme is discussed based on physical analysis/equation to facilitate device parameter optimization for SRAM cell design in back-gated FD/SOI technologies. Numerical 2-D mixed-mode device/circuit simulation results validate the merits and advantages of the proposed scheme.
Original languageEnglish
Pages (from-to)3033-3040
Number of pages8
JournalIEEE Transactions on Electron Devices
Issue number12
StatePublished - Dec 2009

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