System scaling for intelligent ubiquitous computing

Jack Y.C. Sun*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

Wafer based 3Dx3D system scaling revolutionizes machine learning (ML) and artificial intelligence (AI) as well as mobile computing. It may trigger a big bang in intelligent ubiquitous computing. 3D CMOS scaling continues with many challenges and opportunities for relentless innovation in materials, processes, devices, circuits, design, EDA, computing architectures, algorithms, and software. 3D stacking and heterogeneous system integration, e.g., CoWoS® and InFO, not only augments but also amplifies the benefits of 3D CMOS logic, 3D memory, integrated specialty technologies and 3D sensors for intelligent ubiquitous computing. The virtuous cycles of 3Dx3D system scaling innovation may expand like a galaxy or universe. The aggregate transistor count in a 3Dx3D sub-system may reach the equivalent of human brain in the 2020s to provide brainlike augmented intelligence.

Original languageEnglish
Title of host publication2017 IEEE International Electron Devices Meeting, IEDM 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1.3.1-1.3.7
ISBN (Electronic)9781538635599
DOIs
StatePublished - 23 Jan 2018
Event63rd IEEE International Electron Devices Meeting, IEDM 2017 - San Francisco, United States
Duration: 2 Dec 20176 Dec 2017

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference63rd IEEE International Electron Devices Meeting, IEDM 2017
CountryUnited States
CitySan Francisco
Period2/12/176/12/17

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