Synthesis and device fabrication of Cu-Ni nanocomposite for low power magnetic microactuation

Yu Wen Huang, Tzu Yuan Chao, Yu-Ting Cheng

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

This paper presents a Cu-Ni nanocomposite film and related CMOS compatible fabrication process using alkaline noncyanide based copper plating solution for low power magnetic microactuation application. The magnetic properties of Cu can be modified from diamagnetism to ferromagnetism via the incorporation of Ni nanoparticles into a Cu matrix to form a Cu-Ni nanocomposite film. Experimental results show that about 9% power consumption reduction of magnetic microactuation could be realized while the actuated coil is made of the Cu-Ni nanocomposite instead of pure Cu. The effective power reduction can be attributed to the magnetic flux density intensification inside the coil.

Original languageAmerican English
Title of host publication2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings
PublisherIEEE
Pages899-902
Number of pages4
ISBN (Print)1424406080, 9781424406081
DOIs
StatePublished - 1 Dec 2007
Event2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007 - Hong Kong, China
Duration: 2 Aug 20075 Aug 2007

Publication series

Name2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007, Proceedings

Conference

Conference2007 7th IEEE International Conference on Nanotechnology - IEEE-NANO 2007
CountryChina
CityHong Kong
Period2/08/075/08/07

Keywords

  • Cu-Ni nanocomposite
  • Earphone microspeaker
  • Electroplating process
  • Low power magnetic microactuation

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