Synthesis and characterization of porous polymeric low dielectric constant films

Yuhuan Xu*, D. W. Zheng, Yipin Tsai, King-Ning Tu, Bin Zhao, Q. Z. Liu, Maureen Brongo, Chung Wo Ong, Chung Loong Choy, George T.T. Sheng, C. H. Tung

*Corresponding author for this work

Research output: Contribution to journalArticle

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Abstract

This paper reports the synthesis and dielectric properties of a porous poly(arylether) material with an ultra-low dielectric constant for interlayer dielectric applications in microelectronics. The porous polymer films were successfully fabricated by a method of organic phase separation and evaporation. A dielectric constant k of 1.8 was achieved for a porous film with an estimated porosity of 40% and average pore size of 3 nm. Electrical and mechanical properties as well as coefficient of thermal expansion for both dense and porous polymer films were measured.

Original languageEnglish
Pages (from-to)309-313
Number of pages5
JournalJournal of Electronic Materials
Volume30
Issue number4
DOIs
StatePublished - 1 Jan 2001

Keywords

  • Poly(arylene) ethers
  • Porous polymer film
  • Ultra-low dielectric constant

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    Xu, Y., Zheng, D. W., Tsai, Y., Tu, K-N., Zhao, B., Liu, Q. Z., Brongo, M., Ong, C. W., Choy, C. L., Sheng, G. T. T., & Tung, C. H. (2001). Synthesis and characterization of porous polymeric low dielectric constant films. Journal of Electronic Materials, 30(4), 309-313. https://doi.org/10.1007/s11664-001-0036-9