Synchrotron radiation based X-ray micro-diffraction study on reliability issues of solder joints in electronic packaging technology

J. O. Suh*, J. W. Nah, King-Ning Tu, N. Tamura

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Orientation distribution of Cu 6Sn 5 and its relationship with orientation of substrate Cu was studied with synchrotron based micro x-ray diffraction. We have obtained Laue spots both from Cu 6Sn 5 and Cu at the same time. From the Laue pattern, orientation distribution maps of Cu 6Sn 5 and Cu were obtained. Orientations Cu 6Sn 5 scallops had strong dependence to that of Cu. [001] direction of Cu 6Sn 5 was always parallel to [110] of Cu, to minimize misfit. It was also found that Cu 6Sn 5 loses its texture as reflow time increases.

Original languageEnglish
Title of host publicationProceedings - IEEE 56th Electronic Components and Technology Conference
Pages1924-1927
Number of pages4
DOIs
StatePublished - 22 Dec 2006
EventIEEE 56th Electronic Components and Technology Conference - San Diego, CA, United States
Duration: 30 May 20062 Jun 2006

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2006
ISSN (Print)0569-5503

Conference

ConferenceIEEE 56th Electronic Components and Technology Conference
CountryUnited States
CitySan Diego, CA
Period30/05/062/06/06

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