Symmetric 3D passive components for RF ICs application

Wei-Zen Chen*, Wen Hui Chen

*Corresponding author for this work

Research output: Contribution to journalConference article

4 Scopus citations

Abstract

This paper proposes novel 3-D symmetric RF passive components, including inductors, transformers, and baluns. Layout areas of these components are drastically reduced by means of stacked structure while the symmetry of input and output ports is also maintained. The area saving of 3-D inductor is up 70 %. The 1:1 transformer shows less than 0.1 % inductance mismatch in a 18 GHz range, and K is up to 0.87 at 17 GHz. The 3-D balun manifests less than 0.8 dB gain mismatch from 5.25GHz to 6GHz and phase error is about 4° at 5.25 GHz according to measurement results. All the components are fabricated in a 0.18 μm standard CMOS process.

Original languageEnglish
JournalIEEE MTT-S International Microwave Symposium Digest
Volume1
DOIs
StatePublished - 18 Aug 2003
Event2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States
Duration: 8 Jun 200313 Jun 2003

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