This paper proposes novel 3-D symmetric RF passive components, including inductors, transformers, and baluns. Layout areas of these components are drastically reduced by means of stacked structure while the symmetry of input and output ports is also maintained. The area saving of 3-D inductor is up 70 %. The 1:1 transformer shows less than 0.1 % inductance mismatch in a 18 GHz range, and K is up to 0.87 at 17 GHz. The 3-D balun manifests less than 0.8 dB gain mismatch from 5.25GHz to 6GHz and phase error is about 4° at 5.25 GHz according to measurement results. All the components are fabricated in a 0.18 μm standard CMOS process.
|Journal||IEEE MTT-S International Microwave Symposium Digest|
|State||Published - 18 Aug 2003|
|Event||2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States|
Duration: 8 Jun 2003 → 13 Jun 2003