Substrate noise suppression technique for power integrity of TSV 3D integration

Po Jen Yang*, Po-Tsang Huang, Wei Hwang

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

3 Scopus citations

Abstract

In this paper, a substrate noise suppression technique is proposed for the power integrity of TSV 3D integrations. This substrate noise suppression technique reduces both substrate and TSV coupling noises using active substrate decouplers (ASDs) to absorb the substrate noise current. Additionally, the ASD placing is also presented to suppress noises effectively for different 3D structures. For a processor-memory stacking integration, the ground bouncing noises can be reduced by 44.1% via the noise suppression technique. The proposed substrate noise suppression technique can enhance the power integrity of TSV 3D-ICs by reducing the coupling substrate noises.

Original languageEnglish
Pages3274-3277
Number of pages4
DOIs
StatePublished - 28 Sep 2012
Event2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012 - Seoul, Korea, Republic of
Duration: 20 May 201223 May 2012

Conference

Conference2012 IEEE International Symposium on Circuits and Systems, ISCAS 2012
CountryKorea, Republic of
CitySeoul
Period20/05/1223/05/12

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